Invention Grant
- Patent Title: Semiconductor chip and method for producing a semiconductor chip
- Patent Title (中): 半导体芯片及其制造方法
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Application No.: US12218492Application Date: 2008-07-14
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Publication No.: US07994519B2Publication Date: 2011-08-09
- Inventor: Michael Fehrer , Uwe Strauss
- Applicant: Michael Fehrer , Uwe Strauss
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Cohen Pontani Lieberman & Pavane LLP
- Priority: DE102007032555 20070712
- Main IPC: H01L27/15
- IPC: H01L27/15
Abstract:
A semiconductor chip (1) comprises a semiconductor body (2) having a semiconductor layer sequence having an active region (23) provided for generating radiation. A contact (4) is arranged on the semiconductor body (2). An injection barrier (5) is formed between the contact (4) and the active region (23). A method for producing a semiconductor chip is also disclosed.
Public/Granted literature
- US20090045426A1 Semiconductor chip and method for producing a semiconductor chip Public/Granted day:2009-02-19
Information query
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