Invention Grant
- Patent Title: Vertically structured LED array light source
- Patent Title (中): 垂直结构的LED阵列光源
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Application No.: US11900576Application Date: 2007-09-12
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Publication No.: US07994524B1Publication Date: 2011-08-09
- Inventor: David Yaunien Chung , Thomas Taoming Chung
- Applicant: David Yaunien Chung , Thomas Taoming Chung
- Agency: Belasco Jacobs & Townsley, LLP
- Agent David A. Belasco
- Main IPC: H01L33/48
- IPC: H01L33/48
Abstract:
A vertical structured Light Emitting Diode (LED) array using wafer level bonding. The process bonds two or more LED arrays vertically to produce light mixing in a small footprint. The vertically bonded LED array contains through substrate vias and a plurality of metal posts coated with solder to form an internal cavity between the LED layers. This LED array structure is intrinsically hermetically sealed.
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