Invention Grant
- Patent Title: White-light light emitting diode chips and fabrication methods thereof
- Patent Title (中): 白光发光二极管芯片及其制造方法
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Application No.: US12417412Application Date: 2009-04-02
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Publication No.: US07994531B2Publication Date: 2011-08-09
- Inventor: Chun-Chi Lin , Tzu-Han Lin , Wei-Hung Kang
- Applicant: Chun-Chi Lin , Tzu-Han Lin , Wei-Hung Kang
- Applicant Address: TW Hsinchu
- Assignee: VisEra Technologies Company Limited
- Current Assignee: VisEra Technologies Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A white-light LED chip and a fabrication method thereof are provided. The white-light LED chip comprises a blue-light LED chip and a phosphor layer directly disposed on a top surface of the blue-light LED chip. The method comprises providing a plurality of blue-light LED chips attached to a substrate, wherein at least one contact pad is formed on the top surface of each blue-light LED chip. A protective layer is formed on the contact pad. A phosphor layer is formed on the top surface of the blue-light LED chip by a molding process, exposing the contact pad. Finally, the protective layer and the substrate are removed from the blue-light LED chip to form a white-light LED chip.
Public/Granted literature
- US20100252845A1 WHITE-LIGHT LIGHT EMITTING DIODE CHIPS AND FABRICATION METHODS THEREOF Public/Granted day:2010-10-07
Information query
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