Invention Grant
US07994566B2 Stacked non-volatile memory with silicon carbide-based amorphous silicon finFETs
有权
堆叠非易失性存储器与碳化硅基非晶硅finFETs
- Patent Title: Stacked non-volatile memory with silicon carbide-based amorphous silicon finFETs
- Patent Title (中): 堆叠非易失性存储器与碳化硅基非晶硅finFETs
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Application No.: US12235970Application Date: 2008-09-23
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Publication No.: US07994566B2Publication Date: 2011-08-09
- Inventor: Chandra Mouli
- Applicant: Chandra Mouli
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Leffert Jay & Polglaze, P.A.
- Main IPC: H01L29/792
- IPC: H01L29/792

Abstract:
A stacked non-volatile memory device uses amorphous silicon based thin film transistors stacked vertically. Each layer of transistors or cells is formed from a deposited a-Si channel region layer having a predetermined concentration of carbon to form a carbon rich silicon film or silicon carbide film, depending on the carbon content. The dielectric stack is formed over the channel region layer. In one embodiment, the dielectric stack is an ONO structure. The control gate is formed over the dielectric stack. This structure is repeated vertically to form the stacked structure. In one embodiment, the carbon content of the channel region layer is reduced for each subsequently formed layer.
Public/Granted literature
- US20090039357A1 STACKED NON-VOLATILE MEMORY WITH SILICON CARBIDE-BASED AMORPHOUS SILICON THIN FILM TRANSISTORS Public/Granted day:2009-02-12
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