Invention Grant
US07994584B2 Semiconductor device having non-silicide region in which no silicide is formed on diffusion layer
有权
具有在扩散层上不形成硅化物的非硅化物区域的半导体器件
- Patent Title: Semiconductor device having non-silicide region in which no silicide is formed on diffusion layer
- Patent Title (中): 具有在扩散层上不形成硅化物的非硅化物区域的半导体器件
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Application No.: US12277456Application Date: 2008-11-25
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Publication No.: US07994584B2Publication Date: 2011-08-09
- Inventor: Takayuki Hiraoka , Kuniaki Utsumi , Tsutomu Kojima , Kenji Honda
- Applicant: Takayuki Hiraoka , Kuniaki Utsumi , Tsutomu Kojima , Kenji Honda
- Applicant Address: JP Tokyo
- Assignee: Kabsuhiki Kaisha Toshiba
- Current Assignee: Kabsuhiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JP2007-333302 20071225
- Main IPC: H01L21/331
- IPC: H01L21/331

Abstract:
A semiconductor device includes first and second MOSFETs corresponding to at least first power source voltage and second power source voltage lower than the first power source voltage, and non-silicide regions formed in drain portions of the first and second MOSFETs and having no silicide formed therein. The first MOSFET includes first diffusion layers formed in source/drain portions, a second diffusion layer formed below a gate portion and formed shallower than the first diffusion layer and a third diffusion layer formed with the same depth as the second diffusion layer in the non-silicide region, and the second MOSFET includes fourth diffusion layers formed in source/drain portions, a fifth diffusion layer formed below a gate portion and formed shallower than the fourth diffusion layer and a sixth diffusion layer formed shallower than the fourth diffusion layer and deeper than the fifth diffusion layer in the non-silicide region.
Public/Granted literature
- US20090159973A1 SEMICONDUCTOR DEVICE HAVING NON-SILICIDE REGION IN WHICH NO SILICIDE IS FORMED ON DIFFUSION LAYER Public/Granted day:2009-06-25
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