Invention Grant
- Patent Title: Semiconductor light receiving device
- Patent Title (中): 半导体光接收装置
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Application No.: US12162640Application Date: 2007-01-26
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Publication No.: US07994601B2Publication Date: 2011-08-09
- Inventor: Takeshi Nakata
- Applicant: Takeshi Nakata
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2006-021399 20060130
- International Application: PCT/JP2007/051313 WO 20070126
- International Announcement: WO2007/086528 WO 20070802
- Main IPC: H01L31/07
- IPC: H01L31/07

Abstract:
The present invention provides a semiconductor light receiving device that prevents local heat generation, has high-speed, high-sensitivity characteristics even at the time of an intensive light input, and exhibits high resistance to light inputs. The semiconductor light receiving device includes light absorption layers (3, 4) formed on an InP semiconductor substrate (1) wherein a buffer layer (21) containing a quaternary compositional material is formed between the InP semiconductor substrate (1) and the light absorption layers (3, 4).
Public/Granted literature
- US20090039453A1 SEMICONDUCTOR LIGHT RECEIVING DEVICE Public/Granted day:2009-02-12
Information query
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