Invention Grant
US07994604B2 Using floating fill metal to reduce power use for proximity communication
有权
使用浮动填充金属来减少接近通信的电力
- Patent Title: Using floating fill metal to reduce power use for proximity communication
- Patent Title (中): 使用浮动填充金属来减少接近通信的电力
-
Application No.: US12317606Application Date: 2008-12-24
-
Publication No.: US07994604B2Publication Date: 2011-08-09
- Inventor: Alex Chow , Robert J. Drost , Ronald Ho , Robert Proebsting
- Applicant: Alex Chow , Robert J. Drost , Ronald Ho , Robert Proebsting , Arlene Proebsting, legal representative
- Applicant Address: US CA Redwood Shores
- Assignee: Oracle America, Inc.
- Current Assignee: Oracle America, Inc.
- Current Assignee Address: US CA Redwood Shores
- Agency: Park, Vaughan, Fleming & Dowler LLP
- Agent Mark Spiller
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/538
Abstract:
One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit a signal using proximity communication. A layer of fill metal is located in proximity to this array of transmission pads, wherein the layer of fill metal is “floating” (e.g., not connected to any signal). Leaving this layer of fill metal floating reduces the parasitic capacitance for the array of transmission pads, which can reduce the amount of power needed to transmit the signal.
Public/Granted literature
- US20090189241A1 Using floating fill metal to reduce power use for proximity communication Public/Granted day:2009-07-30
Information query
IPC分类:
