Invention Grant
- Patent Title: Magnetically alignable integrated circuit device
- Patent Title (中): 磁性校准集成电路器件
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Application No.: US11996604Application Date: 2005-08-24
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Publication No.: US07994608B2Publication Date: 2011-08-09
- Inventor: Ai Min Tan , Gerald Ofner , Swain Hong Yeo , Mary Teo , Pei Siang Lim
- Applicant: Ai Min Tan , Gerald Ofner , Swain Hong Yeo , Mary Teo , Pei Siang Lim
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- International Application: PCT/IB2005/002513 WO 20050824
- International Announcement: WO2007/023327 WO 20070301
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/58
Abstract:
An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.
Public/Granted literature
- US20080265367A1 Magnetically Alignable Integrated Circuit Device Public/Granted day:2008-10-30
Information query
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