Invention Grant
US07994609B2 Shielding for integrated capacitors 失效
集成电容器屏蔽

  • Patent Title: Shielding for integrated capacitors
  • Patent Title (中): 集成电容器屏蔽
  • Application No.: US12276289
    Application Date: 2008-11-21
  • Publication No.: US07994609B2
    Publication Date: 2011-08-09
  • Inventor: Patrick J. Quinn
  • Applicant: Patrick J. Quinn
  • Applicant Address: US CA San Jose
  • Assignee: Xilinx, Inc.
  • Current Assignee: Xilinx, Inc.
  • Current Assignee Address: US CA San Jose
  • Agent Scott Hewett; John J. King
  • Main IPC: H01L21/02
  • IPC: H01L21/02
Shielding for integrated capacitors
Abstract:
A capacitor in an integrated circuit (“IC”) includes a core capacitor portion having first conductive elements electrically connected to and forming a part of a first node of the capacitor formed in a first layer and second conductive elements electrically connected to and forming a part of a second node of the capacitor formed in the first layer. The first and second conductive elements alternate in the first conductive layer. Third conductive elements electrically connected to and forming a part of the first node are formed in a second layer adjacent to the first layer. The capacitor also includes a shield capacitor portion having fourth conductive elements formed in at least first, second, third, and fourth layers. The shield capacitor portion is electrically connected to and forms a part of the second node of the capacitor and surrounds the first and third conductive elements.
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