A sensor module has a carrier substrate having a bottom side and a top side, a sensor chip arranged on the top side of the carrier substrate and having a pressure-sensitive active area, a signal-processing chip arranged on the top side of the carrier substrate next to the sensor chip and being connected to the sensor chip in an electrically conducting manner, a continuous casting material covering the top side of the carrier substrate and the signal-processing chip and being in mechanical contact with both, the casting material having a recess which is arranged such that the casting material does not cover at least a part of the active area of the sensor chip.