Invention Grant
- Patent Title: Bridge stack integrated circuit package system
- Patent Title (中): 桥式堆栈集成电路封装系统
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Application No.: US11555682Application Date: 2006-11-01
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Publication No.: US07994619B2Publication Date: 2011-08-09
- Inventor: Richard P. Sheridan , Eric Gongora , Douglas J. Mathews
- Applicant: Richard P. Sheridan , Eric Gongora , Douglas J. Mathews
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
An integrated circuit package system is provided including mounting a first device on a carrier, mounting a second device over the first device and the carrier in an offset face-to-face configuration, and connecting the first device and the second device at an overlap.
Public/Granted literature
- US20080111222A1 BRIDGE STACK INTEGRATED CIRCUIT PACKAGE SYSTEM Public/Granted day:2008-05-15
Information query
IPC分类:
