Invention Grant
US07994622B2 Microelectronic packages having cavities for receiving microelectric elements
有权
具有用于接收微电子元件的腔的微电子封装
- Patent Title: Microelectronic packages having cavities for receiving microelectric elements
- Patent Title (中): 具有用于接收微电子元件的腔的微电子封装
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Application No.: US12148144Application Date: 2008-04-16
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Publication No.: US07994622B2Publication Date: 2011-08-09
- Inventor: Ilyas Mohammed , Belgacem Haba , Wael Zohni , Philip R. Osborn
- Applicant: Ilyas Mohammed , Belgacem Haba , Wael Zohni , Philip R. Osborn
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/00
Abstract:
Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.
Public/Granted literature
- US20080303132A1 Semiconductor chip packages having cavities Public/Granted day:2008-12-11
Information query
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