Invention Grant
US07994642B2 Semiconductor device which includes contact plug and embedded interconnection connected to contact plug
失效
包括接触插头和与接触插头相连的嵌入式互连的半导体器件
- Patent Title: Semiconductor device which includes contact plug and embedded interconnection connected to contact plug
- Patent Title (中): 包括接触插头和与接触插头相连的嵌入式互连的半导体器件
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Application No.: US12574402Application Date: 2009-10-06
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Publication No.: US07994642B2Publication Date: 2011-08-09
- Inventor: Makoto Sakuma , Yasushi Kumagai
- Applicant: Makoto Sakuma , Yasushi Kumagai
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPP2008-259939 20081006
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/4763
Abstract:
A semiconductor memory device includes: a first dielectric formed on top of a semiconductor substrate; a contact plug embedded in the first dielectric; a second dielectric formed on top of the first interlayer dielectric; an interconnection layer embedded in a groove formed in the second dielectric on top of the contact plug; and an insulating film formed in the second dielectric adjacent to a side surface of the interconnection layer. The contact plug has a notch in a part of a top surface of the contact plug. The insulating film is formed to extend from a top surface of the second dielectric to the notch included in the contact plug.
Public/Granted literature
- US20100084770A1 SEMICONDUCTOR DEVICE WHICH INCLUDES CONTACT PLUG AND EMBEDDED INTERCONNECTION CONNECTED TO CONTACT PLUG Public/Granted day:2010-04-08
Information query
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