Invention Grant
- Patent Title: Electronic component tester
- Patent Title (中): 电子元件测试仪
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Application No.: US12579955Application Date: 2009-10-15
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Publication No.: US07994804B2Publication Date: 2011-08-09
- Inventor: Takanori Miya , Isao Hayami , Shoichi Tanaka
- Applicant: Takanori Miya , Isao Hayami , Shoichi Tanaka
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-302369 20081127; JP2009-203632 20090903
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/26

Abstract:
The electronic component tester includes: a socket configured to supply power to connection terminals for operating an electronic component; an electronic component mount member on which the electronic component is to be mounted; and a temperature adjusting member which is configured to come into contact with the electronic component mount member to keep the electronic component at a predetermined temperature. The electronic component mount member includes a heat transfer plate on which the electronic component is to be mounted and which is configured to come into contact with the temperature adjusting member, and an electronic component cover for covering the electronic component. The heat transfer plate includes through holes.
Public/Granted literature
- US20100127712A1 ELECTRONIC COMPONENT TESTER Public/Granted day:2010-05-27
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