Invention Grant
- Patent Title: Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguide
- Patent Title (中): 在多层波导基板和包括多层波导中的扼流结构的金属波导基板之间的波导连接
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Application No.: US12307755Application Date: 2007-10-30
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Publication No.: US07994881B2Publication Date: 2011-08-09
- Inventor: Takuya Suzuki
- Applicant: Takuya Suzuki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-295688 20061031
- International Application: PCT/JP2007/071116 WO 20071030
- International Announcement: WO2008/053886 WO 20080508
- Main IPC: H01P1/04
- IPC: H01P1/04
Abstract:
A rectangular conductor pattern is formed around a first waveguide on a multilayer dielectric substrate facing a metal substrate, with an end at about λ/4 away from a long side edge of the first waveguide, where λ is a free-space wavelength of a signal wave. A conductor opening is formed between the end of the conduction pattern and the long side edge of the first waveguide, with a length longer than a long side of the first waveguide and shorter than about λ. A closed-ended dielectric transmission path is formed in the multilayer dielectric substrate in the layer direction, with a length of about λg/4, where λg is an in-substrate effective wavelength of the signal wave.
Public/Granted literature
- US20090309680A1 WAVEGUIDE CONNECTION STRUCTURE Public/Granted day:2009-12-17
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