Invention Grant
- Patent Title: Substrate conveyance device and substrate conveyance method, exposure apparatus and exposure method, device manufacturing method
- Patent Title (中): 基板输送装置及基板输送方法,曝光装置及曝光方法,装置的制造方法
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Application No.: US11652015Application Date: 2007-01-11
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Publication No.: US07995186B2Publication Date: 2011-08-09
- Inventor: Atsushi Ohta , Takashi Horiuchi
- Applicant: Atsushi Ohta , Takashi Horiuchi
- Applicant Address: JP Katta-gun JP Tokyo
- Assignee: Zao Nikon Co., Ltd.,Nikon Corporation
- Current Assignee: Zao Nikon Co., Ltd.,Nikon Corporation
- Current Assignee Address: JP Katta-gun JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-349550 20031008
- Main IPC: G03B27/52
- IPC: G03B27/52

Abstract:
A lithographic projection apparatus includes a substrate table configured to hold a substrate, a projection system arranged to project a patterned beam of radiation onto the substrate, a liquid supply system configured to supply liquid to a space between the projection system and the substrate, and a residual liquid detector configured to detect liquid remaining on the substrate and/or the substrate table after an exposure is completed. A device manufacturing method includes projecting, using a projection system of a lithographic apparatus, a patterned beam of radiation through a liquid onto a substrate, the substrate being held by a substrate table, and, after the projecting is complete, detecting residual liquid on the substrate and/or the substrate table.
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