Invention Grant
- Patent Title: Method and apparatus for securely dechucking wafers
- Patent Title (中): 用于安全地脱扣晶片的方法和装置
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Application No.: US12172669Application Date: 2008-07-14
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Publication No.: US07995323B2Publication Date: 2011-08-09
- Inventor: Chung-Tsung Lu , Pin-Chia Su , Yu-Chih Liou
- Applicant: Chung-Tsung Lu , Pin-Chia Su , Yu-Chih Liou
- Applicant Address: TW Hsin-Chu US CA Fremont
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.,Lam Research
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.,Lam Research
- Current Assignee Address: TW Hsin-Chu US CA Fremont
- Agency: Thomas|Kayden
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01T23/00

Abstract:
A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected.
Public/Granted literature
- US20100008014A1 METHOD AND APPARATUS FOR SUCURELY DECHUCKING WAFERS Public/Granted day:2010-01-14
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