Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12694166Application Date: 2010-01-26
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Publication No.: US07995334B2Publication Date: 2011-08-09
- Inventor: Stephen R. McClure , Joshua D. Banko , John P. Ternus
- Applicant: Stephen R. McClure , Joshua D. Banko , John P. Ternus
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Beyer Law Group LLP
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.
Public/Granted literature
- US20110164371A1 PRINTED CIRCUIT BOARD Public/Granted day:2011-07-07
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