Invention Grant
- Patent Title: Electronic device with heat dissipating mechanism
- Patent Title (中): 具有散热机构的电子装置
-
Application No.: US12727242Application Date: 2010-03-19
-
Publication No.: US07995341B2Publication Date: 2011-08-09
- Inventor: Hung-Yi Wu , Xiao-Zhu Chen
- Applicant: Hung-Yi Wu , Xiao-Zhu Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent Zhigang Ma
- Priority: CN200910312274 20091225
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An electronic device includes a base and a sidewall attached to the base. The sidewall includes a heat dissipating area defining a plurality of vents, a sliding plate slidably coupled to an inner side of the sidewall, and a controlling arm made of metal material having high coefficient of thermal expansion. The controlling arm is connected between the sliding plate and the sidewall, for driving the sliding plate to slide to cover or uncover the vents of the heat dissipating area according to different interior temperature of the electronic device.
Public/Granted literature
- US20110157822A1 ELECTRONIC DEVICE WITH HEAT DISSIPATING MECHANISM Public/Granted day:2011-06-30
Information query