Invention Grant
- Patent Title: Cooling unit and electronic device
- Patent Title (中): 冷却单元和电子设备
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Application No.: US12458685Application Date: 2009-07-20
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Publication No.: US07995343B2Publication Date: 2011-08-09
- Inventor: Kenji Suzuki , Tadanori Tachikawa
- Applicant: Kenji Suzuki , Tadanori Tachikawa
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2008-243238 20080922
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A cooling unit includes: a heat-radiating section in which a coolant flows and which radiates heat caught by the coolant; and a path where the coolant flows through the heat-radiating section; a pump on the path to cause the coolant to flow; and heat absorbing sections disposed on the path to touch heat-producing elements having different heating values, in which the coolant runs to absorb heat produced by the heat-producing elements. One of the heat-absorbing sections is a maximum-heat-absorbing section that touches a maximum-heat-producing element and is disposed downstream from the pump and upstream from the heat-radiating section in a flow of the coolant on the path. Another one of the heat absorbing sections is a low-heat absorbing section that touches the heat-producing element except the maximum-heat-producing element and is disposed upstream from the pump and downstream from the heat-radiating section in the flow of the coolant on the path.
Public/Granted literature
- US20100073875A1 Cooling unit and electronic device Public/Granted day:2010-03-25
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