The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled. In order to prevent short-circuits and allow power connections, an additional layer is arranged on the printed board above the inlay and simultaneously below the component to be cooled and comprises thermic provisions between a component to be cooled and the inlay for ensuring a good to excellent heat conduction from the heating zone of a component to be cooled to the inlay.