Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12691154Application Date: 2010-01-21
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Publication No.: US07995352B2Publication Date: 2011-08-09
- Inventor: Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
- Applicant: Yasushi Inagaki , Motoo Asai , Dongdong Wang , Hideo Yabashi , Seiji Shirai
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP11-248311 19990902; JP11-360306 19991220; JP2000-103730 20000405; JP2000-103731 20000405; JP2000-103732 20000405; JP2000-103733 20000405; JP2000-221349 20000721; JP2000-221351 20000721; JP2000-221352 20000721; JP2000-221353 20000721; JP2000-221354 20000721
- Main IPC: H05K1/18
- IPC: H05K1/18
Abstract:
Chip capacitors are provided in a printed circuit board. In this manner, the distance between an IC chip and each chip capacitor is shortened, and the loop inductance is reduced. In addition, the chip capacitors are accommodated in a core substrate having a large thickness. Therefore, the thickness of the printed circuit board does not become large.
Public/Granted literature
- US20100118502A1 PRINTED CIRCUIT BOARD Public/Granted day:2010-05-13
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