Invention Grant
- Patent Title: Method of alignment for efficient defect review
- Patent Title (中): 高效缺陷检查对齐方法
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Application No.: US11907434Application Date: 2007-10-12
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Publication No.: US07995833B2Publication Date: 2011-08-09
- Inventor: Takehiko Konno , Hiroshi Miyai
- Applicant: Takehiko Konno , Hiroshi Miyai
- Applicant Address: JP Tokyo JP Ibaraki
- Assignee: Hitachi High-Technologies Corporation,Hitachi Science Systems Ltd.
- Current Assignee: Hitachi High-Technologies Corporation,Hitachi Science Systems Ltd.
- Current Assignee Address: JP Tokyo JP Ibaraki
- Agency: McDermott Will & Emery LLP
- Priority: JP2003-145600 20030523
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06K9/32
Abstract:
An inspection system includes a SEM visual inspection apparatus for detecting a defect in a semiconductor sample in steps of manufacturing a semiconductor device and a review apparatus for observing, at a high resolution, the defect in the semiconductor sample detected by the SEM visual inspection apparatus. The system has a function of transmitting an alignment dictionary image as one of alignment parameters to be set by the SEM visual inspection apparatus using an inspection recipe to the review apparatus.
Public/Granted literature
- US20080042061A1 Method of alignment for efficient defect review Public/Granted day:2008-02-21
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