Invention Grant
- Patent Title: Structural analysis of a printed wiring substrate
- Patent Title (中): 印刷布线基板的结构分析
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Application No.: US12553326Application Date: 2009-09-03
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Publication No.: US07996196B2Publication Date: 2011-08-09
- Inventor: Daisuke Mizutani , Nobutaka Itoh
- Applicant: Daisuke Mizutani , Nobutaka Itoh
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Main IPC: G06F7/60
- IPC: G06F7/60 ; G06G7/48 ; C03B37/07 ; C03B5/24

Abstract:
A first generation portion divides an object to be analyzed into a plurality of finite elements to generate element division data. A first calculation portion defines and calculates a plurality of meshes dividing the object to be analyzed into units larger than the finite elements. A second generation portion assumes that a friction layer which has a thickness of “0” and a friction coefficient between a conductive material and a composite material of a predetermined value less than 1 exists at the interface between the conductive material and the composite material, and the second generation portion generates mesh data. A second calculation portion uses various solvers to calculate the physical amounts produced in the object to be analyzed on the basis of the mesh data and outputs the analysis result. In other words, the second calculation portion performs a simulation of the behavior of the object to be analyzed.
Public/Granted literature
- US20090326883A1 ANALYZER, ANALYSIS METHOD, AND ANALYSIS PROGRAM PRODUCT Public/Granted day:2009-12-31
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