Invention Grant
- Patent Title: Messaging mechanism for inter processor communication
- Patent Title (中): 交互处理器通信的消息传递机制
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Application No.: US11800091Application Date: 2007-05-03
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Publication No.: US07996574B2Publication Date: 2011-08-09
- Inventor: Reema Gupta , Yao Wang , Alesia Tringale
- Applicant: Reema Gupta , Yao Wang , Alesia Tringale
- Applicant Address: US MA Hopkinton
- Assignee: EMC Corporation
- Current Assignee: EMC Corporation
- Current Assignee Address: US MA Hopkinton
- Agency: BainwoodHuang
- Main IPC: G06F3/00
- IPC: G06F3/00 ; G06F11/00

Abstract:
An apparatus and method are provided for connecting a host Enterprise System Connection Architecture (ESCON) Input/Output (I/O) interface to a cache of a data storage system. The apparatus includes (a) a set of at least 4 pipelines, each pipeline being coupled on a first end to the host ESCON I/O interface and being coupled on a second end to the cache, (b) a plurality of line processors, each line processor controlling one or more of the pipelines of the set of pipelines, and (c) in each pipeline, a protocol engine, the protocol engine configured to distinguish user data from frame header data and separate the user data from the frame header data for transport over the pipeline.
Public/Granted literature
- US20070271572A1 Messaging mechanism for inter processor communication Public/Granted day:2007-11-22
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