Invention Grant
- Patent Title: Structure for hub for supporting high capacity memory subsystem
- Patent Title (中): 支持高容量内存子系统的集线器结构
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Application No.: US12053231Application Date: 2008-03-21
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Publication No.: US07996641B2Publication Date: 2011-08-09
- Inventor: Gerald K. Bartley , John M. Borkenhagen , Philip Raymond Germann
- Applicant: Gerald K. Bartley , John M. Borkenhagen , Philip Raymond Germann
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Roy W. Truelson
- Main IPC: G06F13/00
- IPC: G06F13/00

Abstract:
A design structure is provided for a hub for use in a high-capacity memory subsystem in which memory modules arranged in one or more clusters, each attached to a respective hub which in turn is attached to a memory controller. Within a cluster, data is interleaved so that each data access command accesses all modules of the cluster. The hub communicates with the memory modules at a lower bus frequency, but the distributing of data among multiple modules enables the cluster to maintain the composite data rate of the memory-controller-to-hub bus. Preferably, the memory system employs buffered memory chips having dual-mode operation, one of which supports a cluster configuration in which data is interleaved and the communications buses operate at reduced bus width and/or reduced bus frequency to match the level of interleaving.
Public/Granted literature
- US20090006706A1 Structure for Hub for Supporting High Capacity Memory Subsystem Public/Granted day:2009-01-01
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