Invention Grant
- Patent Title: Surface acoustic wave pressure sensor
- Patent Title (中): 表面声波压力传感器
-
Application No.: US12656209Application Date: 2010-01-21
-
Publication No.: US08006563B2Publication Date: 2011-08-30
- Inventor: Akihiko Teshigahara , Hideaki Yamada
- Applicant: Akihiko Teshigahara , Hideaki Yamada
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2009-013853 20090126
- Main IPC: G01L11/04
- IPC: G01L11/04

Abstract:
A sensor chip has a substrate and a comb-teeth electrode arranged on the substrate. The sensor chip is fixed to a diaphragm structure to be distorted by receiving pressure, and is fixed to the diaphragm structure only through a predetermined fix area so as to detect the pressure. The fix area is defined on only a part of the sensor chip opposing to the diaphragm structure. The sensor chip is restrained by the diaphragm structure in a direction of transmitting surface acoustic wave. Flexibility of the sensor chip in a perpendicular direction approximately perpendicular to the wave transmitting direction is larger than that in the transmitting direction.
Public/Granted literature
- US20100186514A1 Surface acoustic wave pressure sensor Public/Granted day:2010-07-29
Information query