Invention Grant
- Patent Title: Substrate treatment apparatus
- Patent Title (中): 基板处理装置
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Application No.: US12177243Application Date: 2008-07-22
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Publication No.: US08006636B2Publication Date: 2011-08-30
- Inventor: Kazuo Terada , Kazuo Sakamoto , Takeshi Uehara
- Applicant: Kazuo Terada , Kazuo Sakamoto , Takeshi Uehara
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-193049 20070725
- Main IPC: B05C11/02
- IPC: B05C11/02 ; B05B15/04

Abstract:
A substrate treatment apparatus of the present invention includes: a holding means for rotatably holding a substrate to be treated; a coating solution supply nozzle for supplying a coating solution onto the front surface of the substrate to be treated held on the holding means; a treatment container with an upper surface open for housing them; an exhaust means for exhausting an atmosphere in the treatment container from the bottom; a multiblade centrifugal fan provided on the inner periphery of the treatment container for flowing airflow on a front surface side of the substrate to the exhaust means; and a controller for controlling the number of rotations of the multiblade centrifugal fan corresponding to the number of rotations of the substrate, wherein the number of rotations of the multiblade centrifugal fan is controlled so that turbulent airflow flowing in a circumferential direction on the front surface of the substrate generated due to the rotation of the substrate is corrected to laminar airflow flowing in a radial direction.
Public/Granted literature
- US20090025637A1 SUBSTRATE TREATMENT APPARATUS Public/Granted day:2009-01-29
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