Invention Grant
- Patent Title: Device for cutting slits in a surface
- Patent Title (中): 用于在表面切割狭缝的装置
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Application No.: US11970061Application Date: 2008-01-07
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Publication No.: US08006774B2Publication Date: 2011-08-30
- Inventor: Teunis Jan Willem Kraaijeveld
- Applicant: Teunis Jan Willem Kraaijeveld
- Applicant Address: NL
- Assignee: Gebr. Kraaijeveld B.V.
- Current Assignee: Gebr. Kraaijeveld B.V.
- Current Assignee Address: NL
- Agency: McDonnell Boehen Hulbert & Berghoff
- Priority: NL1033182 20070108
- Main IPC: A01B45/04
- IPC: A01B45/04

Abstract:
The invention relates to a device for cutting slits in a surface, for instance a turf cover, comprising a frame displaceable over the surface, a movable cutter on the frame and oriented during use toward the surface for the purpose of cutting slits in the surface. The invention is distinguished in that the device comprises collecting means for collecting the material cut from the surface by means of the cutter.The invention also relates to a dispensing device, comprising a filler material container, a channel to an outflow opening oriented toward a slit, which channel is connected to the filler material container, and a dispensing mechanism in at least one of the channel and the filler material container.
Public/Granted literature
- US20080164040A1 Device for Cutting Slits in a Surface Public/Granted day:2008-07-10
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