Invention Grant
US08007218B2 Unit and method for transferring substrates and apparatus and method for treating substrates with the unit
有权
用于转移基材的装置和方法以及用该单元处理基材的方法和方法
- Patent Title: Unit and method for transferring substrates and apparatus and method for treating substrates with the unit
- Patent Title (中): 用于转移基材的装置和方法以及用该单元处理基材的方法和方法
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Application No.: US12458098Application Date: 2009-06-30
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Publication No.: US08007218B2Publication Date: 2011-08-30
- Inventor: Dong-Seok Park , Sang-Ho Seol
- Applicant: Dong-Seok Park , Sang-Ho Seol
- Applicant Address: KR Gyeonggi-do
- Assignee: PSK Inc.
- Current Assignee: PSK Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2007-0042599 20070502
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
The present invention is related to a method for transferring substrates. The method comprise simultaneously transferring two substrates, by means of a transfer unit, between first support plates disposed to be vertically spaced apart from each other and second support plates arranged abreast in a lateral direction. The transfer unit comprises a top blade and a bottom blade converted to a folded state where they are vertically disposed to face each other and an unfolded state where they rotate at a preset angle in opposite directions. The transfer unit place/take a substrate on/out of the first support plates under the folded state and place/take a substrate on/out of the second support plates under the unfolded state.
Public/Granted literature
Information query
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