Invention Grant
- Patent Title: Contact assembly having an integrally formed capacitive element
- Patent Title (中): 具有整体形成的电容元件的触头组件
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Application No.: US12493898Application Date: 2009-06-29
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Publication No.: US08007316B2Publication Date: 2011-08-30
- Inventor: Brian Patrick Costello
- Applicant: Brian Patrick Costello
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A contact assembly includes a conductive body, a dielectric layer and a conductive layer. The conductive body extends along a longitudinal axis between a mating end and a mounting end. The dielectric layer is disposed over the conductive body between the mating end and the mounting end. The conductive layer is disposed over the dielectric layer and is separated from the conductive body by the dielectric layer. The conductive layer, the dielectric layer, and the conductive body form a capacitive element.
Public/Granted literature
- US20100330851A1 CONTACT ASSEMBLY HAVING AN INTEGRALLY FORMED CAPACITIVE ELEMENT Public/Granted day:2010-12-30
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