Invention Grant
- Patent Title: Vapor-phase epitaxial growth method and vapor-phase epitaxy apparatus
- Patent Title (中): 气相外延生长法和气相外延装置
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Application No.: US11725467Application Date: 2007-03-20
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Publication No.: US08007588B2Publication Date: 2011-08-30
- Inventor: Hideki Ito , Satoshi Inada , Yoshikazu Moriyama
- Applicant: Hideki Ito , Satoshi Inada , Yoshikazu Moriyama
- Applicant Address: JP Shizuoka
- Assignee: NuFlare Technology, Inc.
- Current Assignee: NuFlare Technology, Inc.
- Current Assignee Address: JP Shizuoka
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2006-075894 20060320
- Main IPC: C30B21/04
- IPC: C30B21/04

Abstract:
A vapor phase epitaxial growth method using a vapor phase epitaxy apparatus having a chamber, a support structure holding thereon a substrate in the chamber, a first flow path supplying a reactant gas for film formation on the substrate and a second flow path for exhaust of the gas, said method includes rotating the substrate, supplying the reactant gas and a carrier gas to thereby perform vapor-phase epitaxial growth of a semiconductor film on the substrate, and during the vapor-phase epitaxial growth of the semiconductor film on the substrate, controlling process parameters to make said semiconductor film uniform in thickness, said process parameters including flow rates and concentrations of the reactant gas and the carrier gas, a degree of vacuum within said chamber, a temperature of the substrate, and a rotation speed of said substrate.
Public/Granted literature
- US20070218664A1 Vapor-phase epitaxial growth method and vapor-phase epitaxy apparatus Public/Granted day:2007-09-20
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