Invention Grant
- Patent Title: Performance enhancing underlayment, underlayment assembly, and method
- Patent Title (中): 表现加强垫层,底层装配和方法
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Application No.: US11316561Application Date: 2005-12-21
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Publication No.: US08007886B2Publication Date: 2011-08-30
- Inventor: Patrick Tierney , Ralph Michael Fay
- Applicant: Patrick Tierney , Ralph Michael Fay
- Applicant Address: US CO Denver
- Assignee: Johns Manville
- Current Assignee: Johns Manville
- Current Assignee Address: US CO Denver
- Agent Robert D. Touslee
- Main IPC: B32B9/00
- IPC: B32B9/00 ; B32B33/00 ; E04B2/00 ; E04B5/00 ; E04C2/00 ; E04C2/34

Abstract:
An underlayment for supplementing one or more physical properties of wall, ceiling, and floor construction components is used to in a wall, ceiling, or floor assembly that may be fabricated on site. The assembly includes: first and second wall, ceiling, or floor construction components which each have physical properties and an underlayment component which has at least one supplemental physical property for supplementing the physical properties of the first and second construction components. The construction components may or may not be secured together with the underlayment sandwiched between the second and first construction components to form a wall, ceiling, or floor assembly with the supplemental physical property or properties of the underlayment. The supplemental physical property or properties of the underlayment may include, but are not limited to, latent storage of thermal energy, sound transmission reduction, and/or burn through resistance.
Public/Granted literature
- US20070137139A1 Performance enhancing underlayment, underlayment assembly, and method Public/Granted day:2007-06-21
Information query