Invention Grant
- Patent Title: Manufacturing methods of asymmetric bumps and pixel structure
- Patent Title (中): 不对称凸块和像素结构的制造方法
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Application No.: US12339076Application Date: 2008-12-19
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Publication No.: US08007987B2Publication Date: 2011-08-30
- Inventor: Te-Yu Chen , Chin-Lung Yeh , Yu-Fang Wang
- Applicant: Te-Yu Chen , Chin-Lung Yeh , Yu-Fang Wang
- Applicant Address: TW Taoyuan
- Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Priority: TW97141477A 20081028
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
A manufacturing method of asymmetric bumps is provided. First, a substrate is provided. A film layer is then formed on the substrate. Next, a complex photomask including at least one transparent region, a number of opaque regions, and a number of semi-transparent regions is provided. Each of the semi-transparent regions is disposed between two adjacent opaque regions, and at least one light-shielding pattern is randomly disposed in each of the semi-transparent regions. The film layer is then patterned with use of the complex photomask, and multiple asymmetric bumps are formed on the substrate. By using the complex photomask, manufacturing steps of the asymmetric bumps can be reduced. Besides, a manufacturing method of a pixel structure having the above-mentioned asymmetric bumps is also provided.
Public/Granted literature
- US20100104956A1 MANUFACTURING METHODS OF ASYMMETRIC BUMPS AND PIXEL STRUCTURE Public/Granted day:2010-04-29
Information query
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