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Invention Grant
US08008130B2 Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board 失效
多层互连板，具有相同的半导体器件及其形成方法以及将半导体芯片安装在互连板上的方法

  • Patent Title: Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
  • Patent Title (中): 多层互连板，具有相同的半导体器件及其形成方法以及将半导体芯片安装在互连板上的方法
  • Application No.: US11727025
    Application Date: 2007-03-23
  • Publication No.: US08008130B2
    Publication Date: 2011-08-30
  • Inventor: Hirokazu Honda
  • Applicant: Hirokazu Honda
  • Applicant Address: JP Kanagawa
  • Assignee: Renesas Electronics Corporation
  • Current Assignee: Renesas Electronics Corporation
  • Current Assignee Address: JP Kanagawa
  • Agency: Young & Thompson
  • Priority: JP11-284566 19991005; JP2000-057767 20000302
  • Main IPC: H01L21/00
  • IPC: H01L21/00 ;  H01L21/44
Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
Abstract:
In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from being bent.
Abstract(Chinese):

根据本发明，在互连板的形成期间，互连板保持牢固地固定到刚性高于互连板的互连板刚性的刚性板上，以抑制互连板的弯曲。

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