Invention Grant
- Patent Title: Shoe sole component
- Patent Title (中): 鞋底组件
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Application No.: US11886047Application Date: 2006-05-10
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Publication No.: US08008363B2Publication Date: 2011-08-30
- Inventor: Sadaki Mori , Katsuhiro Imazato , Kenichi Harano , Akiyuki Morikawa
- Applicant: Sadaki Mori , Katsuhiro Imazato , Kenichi Harano , Akiyuki Morikawa
- Applicant Address: JP Kobe
- Assignee: ASICS Corporation
- Current Assignee: ASICS Corporation
- Current Assignee Address: JP Kobe
- Agent Michael E. Zall
- Priority: JP2005-137499 20050510
- International Application: PCT/JP2006/009388 WO 20060510
- International Announcement: WO2006/121069 WO 20061116
- Main IPC: B29C44/34
- IPC: B29C44/34 ; C08F110/00 ; C08F210/00 ; C08F8/00 ; A43B13/00 ; A43B13/12 ; A43B5/00

Abstract:
There is provided a shoe sole component that has properties such as strength and cushioning property that are suppressed from being changed even under a wide temperature range from severe cold at −10° C. or lower to high temperature conditions exceeding 30° C. A shoe sole component includes a cross-linked foam of a resin composition, the resin composition containing a thermoplastic polyolefin resin, in which tan δ [−20° C. to 40° C.] at a frequency of 10 Hz measured according to JIS K 7244-4 is 0.01 to 0.5, and tan δ [−20° C.]/tan δ [40° C.] at a frequency of 10 Hz is 0.7 to 1.3.
Public/Granted literature
- US20080229622A1 Shoe Sole Component Public/Granted day:2008-09-25
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