Invention Grant
US08008601B2 Laser processing method, laser processing apparatus and spring arm manufacturing method
有权
激光加工方法，激光加工装置和弹簧臂制造方法
- Patent Title: Laser processing method, laser processing apparatus and spring arm manufacturing method
- Patent Title (中): 激光加工方法，激光加工装置和弹簧臂制造方法
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Application No.: US11974320Application Date: 2007-10-12
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Publication No.: US08008601B2Publication Date: 2011-08-30
- Inventor: Akihiko Ushimaru , Yoshiaki Yanagida , Koji Sudo
- Applicant: Akihiko Ushimaru , Yoshiaki Yanagida , Koji Sudo
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2006-341374 20061219
- Main IPC: B23K26/00
- IPC: B23K26/00
Abstract:
A laser processing method includes the steps of: preparing a long metal object to be irradiated; and irradiating the object with a laser beam at a certain portion in a longitudinal direction of the object. The irradiation is performed along a width direction of the object for both a first half path from one end to the other end of the object in the width direction and a return path from the other end to the one end so that the object can be bent.
Public/Granted literature
- US20080142492A1 Laser processing method, laser processing apparatus and spring arm manufacturing method Public/Granted day:2008-06-19
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