Invention Grant
- Patent Title: Package for mounting an optical element and a method of manufacturing the same
- Patent Title (中): 用于安装光学元件的封装及其制造方法
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Application No.: US10988521Application Date: 2004-11-16
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Publication No.: US08008675B2Publication Date: 2011-08-30
- Inventor: Hideaki Takemori , Satoshi Higashiyama , Kazuhiro Hirose
- Applicant: Hideaki Takemori , Satoshi Higashiyama , Kazuhiro Hirose
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Dickstein Shapiro LLP
- Priority: JP2003-420285 20031218
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
The optical mounting package of the present invention is featured by mounting a silicon frame on an insulating substrate for mounting the optical element. The package of the present invention is also featured by that the frame mounted on the insulating substrate for mounting the optical element is made of silicon. A method of manufacturing the package of the present invention is featured by mounting the silicon wafer on the insulating substrate.
Public/Granted literature
- US20050132747A1 Package for mounting an optical element and a method of manufacturing the same Public/Granted day:2005-06-23
Information query
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