Invention Grant
- Patent Title: Image sensor with backside passivation and metal layer
- Patent Title (中): 具有背面钝化和金属层的图像传感器
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Application No.: US12129599Application Date: 2008-05-29
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Publication No.: US08008695B2Publication Date: 2011-08-30
- Inventor: Howard E. Rhodes , Hidetoshi Nozaki
- Applicant: Howard E. Rhodes , Hidetoshi Nozaki
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: H01L31/062
- IPC: H01L31/062

Abstract:
An image sensor includes a semiconductor layer that low-pass filters light of different wavelengths. For example, the semiconductor layer proportionately absorbs photons of shorter wavelengths and proportionately passes more photons of longer wavelengths such that the longer wavelength photons often pass through without being absorbed. An imaging pixel having a photodiode is formed on a front surface of the semiconductor layer, where the photodiode is an N− region formed within the P-type region of the semiconductor layer. A P+ layer is formed between the N− region of the photodiode and a back surface of the semiconductor layer. A mirror that primarily reflects photons of red and/or infra-red wavelengths is formed on the back surface of the semiconductor layer.
Public/Granted literature
- US20090294811A1 IMAGE SENSOR WITH BACKSIDE PASSIVATION AND METAL LAYER Public/Granted day:2009-12-03
Information query
IPC分类: