Invention Grant
US08008718B2 Semiconductor device and production method thereof 有权
半导体装置及其制造方法

  • Patent Title: Semiconductor device and production method thereof
  • Patent Title (中): 半导体装置及其制造方法
  • Application No.: US11792048
    Application Date: 2005-10-17
  • Publication No.: US08008718B2
    Publication Date: 2011-08-30
  • Inventor: Sumio Katou
  • Applicant: Sumio Katou
  • Applicant Address: JP Osaka
  • Assignee: Sharp Kabushiki Kaisha
  • Current Assignee: Sharp Kabushiki Kaisha
  • Current Assignee Address: JP Osaka
  • Agency: Nixon & Vanderhye P.C.
  • Priority: JP2004-361981 20041214
  • International Application: PCT/JP2005/019060 WO 20051017
  • International Announcement: WO2006/064606 WO 20060622
  • Main IPC: H01L27/088
  • IPC: H01L27/088
Semiconductor device and production method thereof
Abstract:
The semiconductor device of the present invention is a semiconductor device including P-type and N-type thin film transistors, at least one of the N-type thin film transistors having an off-set gate structure, at least one of the P-type thin film transistors having a LDD structure, wherein a P-type high concentration impurity layer for forming the at least one P-type thin film transistor is formed on the semiconductor layer in a region other than a region below a gate electrode and a sidewall spacer and contains a higher concentration of a P-type impurity together with an impurity contained in an N-type low concentration impurity layer and an N-type high concentration impurity layer for forming the N type thin film transistor.
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