Invention Grant
- Patent Title: Semiconductor device and production method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11792048Application Date: 2005-10-17
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Publication No.: US08008718B2Publication Date: 2011-08-30
- Inventor: Sumio Katou
- Applicant: Sumio Katou
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2004-361981 20041214
- International Application: PCT/JP2005/019060 WO 20051017
- International Announcement: WO2006/064606 WO 20060622
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
The semiconductor device of the present invention is a semiconductor device including P-type and N-type thin film transistors, at least one of the N-type thin film transistors having an off-set gate structure, at least one of the P-type thin film transistors having a LDD structure, wherein a P-type high concentration impurity layer for forming the at least one P-type thin film transistor is formed on the semiconductor layer in a region other than a region below a gate electrode and a sidewall spacer and contains a higher concentration of a P-type impurity together with an impurity contained in an N-type low concentration impurity layer and an N-type high concentration impurity layer for forming the N type thin film transistor.
Public/Granted literature
- US20070295976A1 Semiconductor Device And Production Method Thereof Public/Granted day:2007-12-27
Information query
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