Invention Grant
US08008727B2 Semiconductor integrated circuit device including a pad and first mosfet
有权
半导体集成电路器件包括焊盘和第一mosfet
- Patent Title: Semiconductor integrated circuit device including a pad and first mosfet
- Patent Title (中): 半导体集成电路器件包括焊盘和第一mosfet
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Application No.: US12010991Application Date: 2008-01-31
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Publication No.: US08008727B2Publication Date: 2011-08-30
- Inventor: Hitoshi Okamoto , Morihisa Hirata
- Applicant: Hitoshi Okamoto , Morihisa Hirata
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2007-022976 20070201
- Main IPC: H01L23/62
- IPC: H01L23/62

Abstract:
To reduce the leak current in the MOSFET connected between the pad and the ground. There are provided a pad PAD for an input or output signal, an n-type MOSFET M1a connected between the pad PAD and the ground and having its gate terminal and backgate connected in common, and a potential control circuit 10 that controls a potential Vb of the gate terminal and the backgate of the n-type MOSFET M1a based on a potential Vin of the pad PAD. The potential control circuit 10 comprises n-type MOSFETs M2 and M3; the n-type MOSFET M1a has its gate terminal and backgate connected to backgates and drains of the n-type MOSFETs M2 and M3; the n-type MOSFET M2 has its source grounded and its gate terminal connected to the pad PAD via a resistance R; and the n-type MOSFET M3 has its source connected to the pad PAD and its gate terminal grounded.
Public/Granted literature
- US20080185653A1 Semiconductor integrated circuit device Public/Granted day:2008-08-07
Information query
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