Invention Grant
US08008764B2 Bridges for interconnecting interposers in multi-chip integrated circuits
有权
用于在多芯片集成电路中互连插入器的桥接器
- Patent Title: Bridges for interconnecting interposers in multi-chip integrated circuits
- Patent Title (中): 用于在多芯片集成电路中互连插入器的桥接器
-
Application No.: US12110579Application Date: 2008-04-28
-
Publication No.: US08008764B2Publication Date: 2011-08-30
- Inventor: Douglas James Joseph , John Ulrich Knickerbocker
- Applicant: Douglas James Joseph , John Ulrich Knickerbocker
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Daniel P. Morris
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H05K7/00
Abstract:
A structure and a method for forming the same. The structure includes a substrate, a first interposer on the substrate, a second interposer on the substrate, and a first bridge. The first and second interposers are electrically connected to the substrate. The first bridge is electrically connected to the first and second interposers.
Public/Granted literature
- US20090267238A1 BRIDGES FOR INTERCONNECTING INTERPOSERS IN MULTI-CHIP INTEGRATED CIRCUITS Public/Granted day:2009-10-29
Information query
IPC分类:
