A semiconductor package includes a first substrate comprising a plurality of pads arranged in a first side of the first substrate, a plurality of first semiconductor chips stacked on the first side of the first substrate and each first semiconductor chip comprising a plurality of chip pads arranged in a first side of respective first semiconductor chips, and a sealant arranged on the first substrate, the sealant sealing the first semiconductor chips, wherein at least one of the first semiconductor chips comprises a plurality of redistribution pads arranged in the first side of the at least one semiconductor chip, and a plurality of adhesive layers having portions exposed by the sealant, each adhesive layer is disposed on respective redistribution pads.