Invention Grant
- Patent Title: Dynamic pad size to reduce solder fatigue
- Patent Title (中): 动态焊盘尺寸以减少焊料疲劳
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Application No.: US12828469Application Date: 2010-07-01
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Publication No.: US08008786B2Publication Date: 2011-08-30
- Inventor: Tim V. Pham , Trent S. Uehling
- Applicant: Tim V. Pham , Trent S. Uehling
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Fortkort & Houston P.C.
- Agent John A. Fortkort
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/44
Abstract:
A semiconductor device is provided which comprises a substrate (501) having a plurality of bond pads (503) disposed thereon. Each bond pad has a major axis and a minor axis in a direction parallel to the substrate, and the ratio of the major axis to the minor axis increases with the distance of a bond pad from the center of the substrate.
Public/Granted literature
- US20100264542A1 DYNAMIC PAD SIZE TO REDUCE SOLDER FATIGUE Public/Granted day:2010-10-21
Information query
IPC分类:
