Invention Grant
- Patent Title: Testing system module
- Patent Title (中): 测试系统模块
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Application No.: US12478774Application Date: 2009-06-05
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Publication No.: US08008938B2Publication Date: 2011-08-30
- Inventor: Cheng-Chin Ni
- Applicant: Cheng-Chin Ni
- Applicant Address: TW Hsin-Chu
- Assignee: King Yuan Electronics Co., Ltd.
- Current Assignee: King Yuan Electronics Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Perkins Coie LLP
- Priority: TW96139881A 20071024
- Main IPC: G01R31/20
- IPC: G01R31/20
Abstract:
A testing system module for testing printed circuit board (PCB) includes at least one robot having a pogo pin for moving to a testing point of the PCB; a pressure detecting unit for detecting a current pressure value on the printed circuit board; and a control system for keeping the pogo pin to contact with the PCB with constant pressure.
Public/Granted literature
- US20090243643A1 TESTING SYSTEM MODULE Public/Granted day:2009-10-01
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