Invention Grant
- Patent Title: Stacked electronic part and method of manufacturing the same
- Patent Title (中): 堆叠的电子部件及其制造方法
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Application No.: US12219519Application Date: 2008-07-23
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Publication No.: US08009012B2Publication Date: 2011-08-30
- Inventor: Takashi Kajino , Hisayuki Abe , Akira Kakinuma , Kazuhiko Itoh
- Applicant: Takashi Kajino , Hisayuki Abe , Akira Kakinuma , Kazuhiko Itoh
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-191583 20070724; JP2008-068230 20080317
- Main IPC: H01C1/012
- IPC: H01C1/012

Abstract:
Provided are a stacked electronic part that can sufficiently suppress plating deposition on the surface of a porous green body when a terminal electrode is formed on an external electrode, thereby enabling a decrease in the reliability of products to be prevented, and a method of manufacturing the stacked electronic part. The stacked electronic part 1 is a PTC thermistor having a stacked body 4 containing a porous green body 2 made of ceramics and having a plurality of vacancies and a plurality of internal electrodes 3 formed within the porous green body 2, and is provided with at least one unit structure 10 in which the porous green body 2 and the internal electrode 3 are stacked. External electrodes 5, 5 are connected to the internal electrode 2, and upon the external electrodes 5, 5 are formed terminal electrodes 7, 7 by plating. Resin is filled in the plurality of vacancies of the porous green body 2 at a filling ratio of not less than 60%.
Public/Granted literature
- US20090027158A1 Stacked electronic part and method of manufacturing the same Public/Granted day:2009-01-29
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