Invention Grant
US08009258B2 Display panel, method of inspecting lead bonding of display panel, and lead bonding method of display panel
有权
显示面板,显示面板引线接合检查方法,显示面板引线接合方法
- Patent Title: Display panel, method of inspecting lead bonding of display panel, and lead bonding method of display panel
- Patent Title (中): 显示面板,显示面板引线接合检查方法,显示面板引线接合方法
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Application No.: US11773969Application Date: 2007-07-06
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Publication No.: US08009258B2Publication Date: 2011-08-30
- Inventor: Yung-Chien Chen
- Applicant: Yung-Chien Chen
- Applicant Address: TW Taoyuan
- Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Priority: TW96108920A 20070315
- Main IPC: G02F1/1345
- IPC: G02F1/1345

Abstract:
A display panel including a substrate and a plurality of films for carrying chips is provided. The substrate has a display region and a non-display region located at one side of the display region. The non-display region has a plurality of pad regions, and each pad region has a plurality of first leads and at least one first displacement measuring mark disposed therein. The first displacement measuring mark is located at at least one side of all the first leads. The films for carrying chips are correspondingly sticking on the substrate. Each film for carrying chips has a plurality of second leads and at least one second displacement measuring mark. The second displacement measuring mark is located at least one side of all the second leads and is corresponding to the first displacement measuring mark. The second leads are correspondingly connected with the first leads.
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