Invention Grant
- Patent Title: ESD improvement with dynamic substrate resistance
- Patent Title (中): 动态衬底电阻ESD改善
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Application No.: US12548586Application Date: 2009-08-27
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Publication No.: US08009399B2Publication Date: 2011-08-30
- Inventor: Da-Wei Lai
- Applicant: Da-Wei Lai
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H02H9/00
- IPC: H02H9/00 ; H02H7/12 ; H02H1/00 ; H02H1/04 ; H02H3/22

Abstract:
In some embodiments, an electrostatic discharge (ESD) protection circuit includes a substrate resistance control circuit coupled to a body of a first NMOS transistor. The substrate resistance control circuit increases a resistance of the body of the first NMOS transistor during an ESD event. The first NMOS transistor has a drain coupled to an input/output (I/O) pad and a gate coupled to a first voltage source. The first voltage source is set at ground potential.
Public/Granted literature
- US20110051298A1 ESD IMPROVEMENT WITH DYNAMIC SUBSTRATE RESISTANCE Public/Granted day:2011-03-03
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