Invention Grant
- Patent Title: Electronic device assembly
- Patent Title (中): 电子设备组装
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Application No.: US12610381Application Date: 2009-11-02
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Publication No.: US08009413B2Publication Date: 2011-08-30
- Inventor: Nian-Feng Zhen
- Applicant: Nian-Feng Zhen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910304759 20090723
- Main IPC: H05K7/16
- IPC: H05K7/16
Abstract:
An electronic device includes a front cover, a keyboard, and a sliding apparatus. The sliding apparatus is slidably coupled to the front cover. The keyboard is pivotally coupled to the sliding apparatus. By pulling the sliding apparatus and rotating the keyboard, the keyboard is foldable on the front cover.
Public/Granted literature
- US20110019343A1 ELECTRONIC DEVICE ASSEMBLY Public/Granted day:2011-01-27
Information query
