Invention Grant
- Patent Title: Integrated circuit and method of forming an integrated circuit
- Patent Title (中): 集成电路和形成集成电路的方法
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Application No.: US12182714Application Date: 2008-07-30
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Publication No.: US08009477B2Publication Date: 2011-08-30
- Inventor: Christoph Kleint , Nicolas Nagel , Dominik Olligs , Matthias Markert
- Applicant: Christoph Kleint , Nicolas Nagel , Dominik Olligs , Matthias Markert
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: G11C11/40
- IPC: G11C11/40 ; H01L27/088 ; H01L29/78 ; H01L21/4763
Abstract:
An integrated circuit and a method of forming an integrated circuit. One embodiment includes a conductive line formed above a surface of a carrier. A slope of the sidewalls of the conductive line in a direction perpendicular to the surface of the carrier reveals a discontinuity and a width of the conductive line in an upper portion thereof is larger than the corresponding width in the lower portion.
Public/Granted literature
- US20100027311A1 INTEGRATED CIRCUIT AND METHOD OF FORMING AN INTEGRATED CIRCUIT Public/Granted day:2010-02-04
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